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Career with Sahasra

Welcome to Sahasra – "We assemble relationships"
Sahasra Group was established in 2000 and the name was chosen keeping in mind the New Millennium. While leveraging its core expertise in electronics manufacturing the group has diversified into the skill development, LED Lighting and electronic distribution verticals and is constantly looking to recruit young and experienced talent to achieve higher growth. Sahasra is a family owned professionally managed business driven by its people.


Company Philosophy on Manpower:
Sahasra believes in aligning individual aspirations to overall organizational objectives. The company invests sizably in training it's human resources so as to constantly keep them attuned to the changing requirements of the industry. The emphasis is on creating an environment, which instills a sense of responsibility in employees to take ownership of their key result areas.
To summarize, the work ethic at Sahasra can best be epitomized with the anecdote of the pupil who in his enthusiasm to outwit his teacher holds the neck of a dove in his hands behind his back and asks his teacher to guess whether the dove is dead or alive? To which the wise old teacher replies "Son, it is all in your hands".


Career Opportunities for Women:
We are committed to gender equality, want more women in our workforce. In during fiscal 2016, approx. 20 percent of our new hires were women. Under the Company Maternity Benefit Policy, we grant 24 weeks paid maternity leave to female employees.


Compensation:
Personnel shall be offered compensation matching best in the industry and shall also be eligible for a discretionary bonus given out by management once a year in the month of October.

Current Openings:


Job Posting Date & Status : 11th June 2021 & ACTIVE

QMS & EHS Engineer

(Engineering)

Job Opening at : Sahasra Electronics Pvt. Ltd.
Job Location : Noida
Salary : Depends on Knowledge & hands on Experience
Job Category : Full-time
Education : B.E / B.Tech in Electronics & Communication with Relevant Experience
Experience : Minimum 5 to 7 year's Experience to in the field of QMS and EHS

Role & Responsibilities : A QMS & EHS Engineer, your responsibilities include the following:

  • Proficiency in the Quality Management systems and EHS Management system i.e. ISO 9001:2015, IATF 16949:2016, ISO/TS 22163:2017, ISO 13485:2016, ISO 14001:2015, ISO 45001:2018 & ANSI/ESD S20.20-2014.

  • Proficiency in measurement and shop floor Management including expertise in Trainings and hands on experience in implanting core tools related to IATF 16949:2016.

  • Customer compliant handling, Rejection Analysis: 7 QC tools; Experience in supplier Quality Assurance for developing suppliers (PPAP approval) & improvement projects.

  • Update, Implement & Maintain all QMS/EHS system, Streamline your team effort with a single tool for managing documents, projects, and communication.

  • Prepare and update the relevant quality system documentation Supports employees when Creating quality system documentation.

  • Successfully completed degree in an engineering or quality discipline or equivalent qualification.

  • Several years of related professional experience (preferred in automotive industry).

  • Experience with Quality Assurance programs and knowledge of statistical quality tools and knowledge of statistical quality tools.

  • Confident and conscientious team player with excellent communication, problem solving and analytical thinking skills.

  • Excellent English and Other language skills both oral and written, hands on skills are preferable.

Note : Interested & Genuine Candidate can email their CV on [email protected] or fill the below mention form.



Job Posting Date & Status : 26th DEC 2020 & ACTIVE

Process Engineer

(Engineering)

Job Opening at : A Sahasra Group Company
Job Location : Bhiwadi
Salary : As per industry trends
Job Category : Full-time
Min. Qualification : B.E / B.Tech in Electronics & Communication or in Electrical & Electronics or Mechanical +> 8 years of experience

We are currently seeking ambitious and highly-skilled enthusiastic Process Engineer with more than 8 years of experience in Process Engineering capable of process optimization in Die attach, wire bonding, molding and Sawing process in any Semiconductor / Electronics Industries. It requires very good knowledge of Process. Candidate should have knowledge to handle the process optimization independently. Candidate has to have the capability to train others also. Candidates for this role will be self-motivated, creative, knowledgeable, and exceptionally well-behaved one.

Role & Responsibilities : A Process Engineer, your responsibilities include the following:

  • To optimize and standardize the critical parameters in Die attach.

  • To optimize and standardize the critical wire bond parameters through DOE.

  • To optimize and standardize the Mold critical parameters through DOE.

  • To optimize and standardize the critical parameters in Saw machine.

  • To optimize and standardize the critical parameters in Saw machine.

  • To ensure that no yield loss in the optimized parameter windows in all sections.

  • To work with equipment supplier application team to optimize the critical parameters.

  • To work with Raw material supplier to optimize the critical process parameters.

  • To work with Raw material supplier and Quality Team for new material qualification.

  • To work with consumable supplier to optimize the critical process parameters.

  • To work with Critical consumable supplier for new material qualification .

  • Yield report preparation.

  • Analyzing the rejection split up in each section and to co-ordinate with Manufacturing and Equipment team to improve the yield.

  • Yield trend monitoring.

  • To ensure to achieve best product yield.

  • Taking necessary corrective & preventive action to improve the yield in case of any abnormality.

  • Co-ordinate with Manufacturing and Equipment team to ensure smooth process flow.

  • SPC chart preparation, monitoring the Average and Range chart for all critical process.

  • Ensure to achieve the target Cpk for all critical process.

  • Periodical update of FMEA.

  • Participates in cross functional meetings and provide suggestions for improvement of the product & process.

  • Provides feedback on any new system features in all assembly operation for implementing it in organization.

  • Ensure to have line discipline & work culture.

Qualifications / Education & Experience Requirements :

  • Diploma in Electronics & Communication or in Electrical & Electronics or Mechanical +> 12 years of experience.

  • B.E / B.Tech in Electronics & Communication or in Electrical & Electronics or Mechanical +> 8 years of experience.

  • Experience in ASM die bonder & wire bonder, K&S Wire bonders, ASM/Towa/ ASA Molding machine, Disco Saw machines.

  • Process Parameter Optimization through DOE experience is required.

  • Knowledge of Process flow & Yield improvement is required.

  • Experience with Six Sigma certificate is a plus.

  • FMEA, SPC knowledge is must.

  • Capability to train others.

  • Excellent verbal and written communications skills.

  • Highly organized, self-motivated, and disciplined abilities.

  • Ability to work with other engineers across multiple disciplines, as well as suppliers of various positions.

Note : Interested & Genuine Candidate can email their CV on [email protected] or fill the below mention form.



Job Posting Date & Status : 26th DEC 2020 & ACTIVE

Wire Bond Equipment Engineer

(Engineering)

Job Opening at : A Sahasra Group Company
Job Location : Bhiwadi
Salary : As per industry trends
Job Category : Full-time
Min. Qualification : B.E / B.Tech in Electronics & Communication or in Electrical & Electronics or Mechanical +> 8 years of experience

We are currently seeking ambitious and highly-skilled enthusiastic Wire Bond Equipment Engineer with more than 8 years of experience in Wire Bond equipment handling in any Semiconductor / Electronics Industries. It requires very good knowledge of Wire Bond Equipment and Process. Candidate should have knowledge to handle equipment & Trouble shooting independently. Candidate has to have the capability to train others also. Candidates for this role will be self-motivated, creative, knowledgeable, and exceptionally well-behaved one.

Role & Responsibilities : A Wire Bond Equipment Engineer, your responsibilities include the following:

  • To participate in equipment, buy off & installation of new equipment and to make it run for production.

  • To work with equipment supplier to understand & to get training from them to ensure smooth operation of the equipment.

  • To understand all process parameters of the equipment & to do required set ups whenever there is a change in product cycle.

  • To train operators to handle equipment without any issues & to provide best product yield.

  • Ensure proper functioning of equipment & Yield monitoring and taking necessary corrective & preventive action to improve the yield in case of any abnormality.

  • Responsible to attend minor break down of equipment & to bring back it to line after servicing.

  • Responsible to keep sufficient spare inventory by coordinating with Purchase & Stores function.

  • To work with Raw material supplier to optimize the critical process parameters.

  • Participates in cross functional meetings and provide suggestions for improvement of the product & process.

  • Provides feedback on any new system features in Wire Bond operation for implementing it in organisation.

  • To work with Critical consumable supplier for new material qualification.

  • Coordinating with Manufacturing team to ensure smooth process flow & to improve OEE & operator efficiency.

  • Ensure to have line discipline & work culture.

  • Knowledge on FMEA, SPC is an added advantage.

  • To know to prepare receipts as per bonding structures and customer requirements.

Qualifications / Education & Experience Requirements :

  • Diploma in Electronics & Communication or in Electrical & Electronics +> 12 years of experience.

  • B.E / B.Tech in Electronics & Communication or in Electrical & Electronics +> 8 years of experience.

  • Experience in handling ASM, K&S Wire bonders.

  • Undergone Training at supplier end is an added advantage.

  • Trouble shooting experience is required.

  • Knowledge of Process flow & Yield improvement is required.

  • Experience with Six Sigma certificate is a plus.

  • Capability to train others.

  • Excellent verbal and written communications skills.

  • Highly organized, self-motivated, and disciplined abilities.

  • Ability to work with other engineers across multiple disciplines, as well as suppliers of various positions.

Note : Interested & Genuine Candidate can email their CV on [email protected] or fill the below mention form.



Job Posting Date & Status : 26th DEC 2020 & ACTIVE

IC Package: Failure Analysis & Reliability Engineer

(Engineering)

Job Opening at : A Sahasra Group Company
Job Location : Bhiwadi
Salary : As per industry trends
Job Category : Full-time
Min. Qualification : B.Tech./BS in materials science with +> 8 years of industry experience

we are looking for an enthusiastic Failure Analysis & Reliability Engineer with more than 3 years of experience in IC package failure analysis and reliability. It requires very good knowledge of IC packaging process flow such as die attach, wire bonding, molding and EOL.

Role & Responsibilities : A Failure Analysis & Reliability Engineer, your responsibilities include the following:

  • IC package Failure analysis flow (customer, internal), debugging, report generation, 8D report.

  • Reliability flow, test requirement as per JEDEC standard.

  • Complete knowledge of FA tools (Prober, Microscope, CSAM, SEM, X-Ray, X-section, de-capping, etc).

  • Complete knowledge of reliability tests with conditions (HAST, TC, MSLs, BLR, ST, T shock, etc).

  • Debugging using prober to verify failures.

  • Basic level knowledge of Performing Electrical Failure Analysis to verify failures.

  • Working with several cross-functional teams for resolving product level issues.

  • Performing Data Analysis and possessing parsing skills to analyse high volume data for quality improvement and yield improvement.

  • Analysing and evaluating component specifications versus performance to ensure optimal match of component requirements with production equipment capabilities.

  • Working with manufacturing and test teams to ensure on-time product qualification.

  • Working with cross-functional teams to resolve external customer related issues.

  • Knowledge of wire bond, die attach, DBG, Molding, Saw singulation, laser mark, laser cut, etc.

  • Materials property and chemistry.

  • Basic knowledge of quality flow.

Preferred Qualifications:

  • Electrical Failure Analysis, identifying root cause of the problems and developing counter measures.

  • Quality, reliability mechanisms and device physics.

  • Wafer and component level testing and yield improvement.

Note : Interested & Genuine Candidate can email their CV on [email protected] or fill the below mention form.



Job Posting Date & Status : 26th DEC 2020 & ACTIVE

Die Attach Equipment Engineer

(Engineering)

Job Opening at : A Sahasra Group Company
Job Location : Bhiwadi
Salary : As per industry trends
Job Category : Full-time
Min. Qualification : B.E / B.Tech in Electronics & Communication or in Electrical & Electronics or Mechanical +> 8 years of experience

We are currently seeking ambitious and highly-skilled enthusiastic Die Attach Equipment Engineer with more than 8 years of experience in Die Attach equipment handling in any Semiconductor / Electronics Industries. It requires very good knowledge of Die Attach Equipment and Process. Candidate should have knowledge to handle equipment & Trouble shooting independently. Candidate has to have the capability to train others also. Candidates for this role will be self-motivated, creative, knowledgeable, and exceptionally well-behaved one.

Role & Responsibilities : A Die Attach Equipment Engineer, your responsibilities include the following:

  • To participate in equipment, buy off & installation of new equipment and to make it run for production.

  • To work with equipment supplier to understand & to get training from them to ensure smooth operation of the equipment.

  • To understand all process parameters of the equipment & to do required set ups whenever there is a change in product cycle.

  • To train operators to handle equipment without any issues & to provide best product yield.

  • Ensure proper functioning of equipment & Yield monitoring and taking necessary corrective & preventive action to improve the yield in case of any abnormality.

  • Responsible to attend minor break down of equipment & to bring back it to line after servicing.

  • Responsible to keep sufficient spare inventory by coordinating with Purchase & Stores function.

  • Participates in cross functional meetings and provide suggestions for improvement of the product & process.

  • Provides feedback on any new system features in Die attach operation for implementing it in organisation.

  • To work with Critical consumable supplier for new material qualification.

  • Coordinating with Manufacturing team to ensure smooth process flow & to improve OEE & operator efficiency.

  • Ensure to have line discipline & work culture.

  • Knowledge on FMEA, SPC is an added advantage.

  • To know to prepare receipts as per bonding structures and customer requirements.

Qualifications / Education & Experience Requirements :

  • Diploma in Electronics & Communication or in Electrical & Electronics +> 12 years of experience.

  • B.E / B.Tech in Electronics & Communication or in Electrical & Electronics +> 8 years of experience.

  • Experience in handling ASM, K&S Die bonders.

  • Undergone Training at supplier end is an added advantage.

  • Trouble shooting experience is required.

  • Knowledge of Process flow & Yield improvement is required.

  • Experience with Six Sigma certificate is a plus.

  • Capability to train others.

  • Excellent verbal and written communications skills.

  • Highly organized, self-motivated, and disciplined abilities.

  • Ability to work with other engineers across multiple disciplines, as well as suppliers of various positions.

Note : Interested & Genuine Candidate can email their CV on [email protected] or fill the below mention form.



Job Posting Date & Status: 7th OCT 2020 & Active

Memory Program Manager

(Engineering)

Job Location : Noida (first few months) then Bhiwadi
Job Category : Full-time
Salary : As per industry trends

Min Qualifications : MBA / M.Tech in Technology Management

Required Experience : 4 years of experience in Memory or IC program management field

Role & Responsibilities : Memory Program Manager, responsibilities include the following:

  • Understand program, generate time line, communicate with all stake holders and deliver on time.

  • Participates in cross functional meetings such as with memory, firmware, product line teams and external material and equipment suppliers.

  • Provides feedback on new system features for next generation memory developments.

  • As a member of the Program Management Team, share collective responsibility for delivering organizational objectives, through active engagement and collaboration with employees at all levels in the organization.

  • Be a role model for effective and positive leadership which is ethical, results driven and future-oriented.

  • Creates a climate in which people are driven to do their best. Can motivate and empower others. Invites input from internal stakeholders.

  • Monitor program compliance and analyze and respond to business information, in particular financial and activity data, to identify underperformance within programs and provide recommendations for operational improvements that enhance program performance.

  • Prepare accurate and timely reports for the Head of Contracts and Program Performance on key performance and productivity trends within program portfolios.

  • Self-motivated and self-starter with minimal guidance.

Required Skills :

  • Knowledge of SI/PI, IC/Memory Package design, Packaging process flow and testing.

  • Experience with embedded storage device packaging is a plus.

  • Highly organized, self-motivated, and disciplined abilities

  • Ability to work with other engineers across multiple disciplines, as well as customers of various positions.

  • Experience working with off-shore teams in a multi-national environment.

  • Offshore travelling will be required

Preferred Skills :

Good Communication, Fit Personality, Young professional, Focused, Hardworking, Good Knowledge of NAND flash package

Note : Interested & Genuine Candidate can email their CV on [email protected] and mention in the subject Post Applied For or fill the below mention form.



Job Posting Date & Status: 7th OCT 2020 & Active

Product Development Engineer

(Engineering)

Job Location : Noida (first few months) then Bhiwadi
Job Category : Full-time
Salary : As per industry trends

Min Qualifications : Electronics Engineering or Computer Science, Master’s preferred

Required Experience : 3-4 years experience in IC testing and or product engineering

Role & Responsibilities : Product Development Engineer, responsibilities include the following:

  • Developing test programs for packaged NAND flash memory, and perform failure analysis and device debugging.

  • Responsible for NAND Product and Package Qual, Rel test setup, eFA & action Plan.

  • Provide correct test programs for advanced memories and define test flow for volume testing needs.

  • Support production and ramp up.

  • Product evaluation DOE of reliability, DPPM improvement, production yield improvement and die sort yield improvement.

  • Delivery of high throughput time on test code development to achieve high Through put Time.

  • Contribute and drive projects assigned by global new product definition teams to bring new products to market.

  • Self-motivated and self-starter with minimal guidance.

Required Skills :

  • Familiar with advanced development test program: ATL or wafer level test program coding.

  • Have knowledge on NAND or DRAM & SRAM testing.

  • Ability to troubleshoot, analyze complex problems, multi-task and meet deadlines.

  • Excellent English communication (written and verbal) and interpersonal skills.

  • Highly organized, self-motivated, and disciplined abilities.

  • Ability to work with other engineers across multiple disciplines, as well as customers of various positions.

Preferred Skills :

Good Communication, Fit Personality, Young professional, Focused, Hardworking, Good Knowledge of NAND flash package

Note : Interested & Genuine Candidate can email their CV on [email protected] and mention in the subject Post Applied For or fill the below mention form.



Job Posting Date & Status: 25th SEP 2020 & Active

PCB Design Engineer (CAM)

(Engineering)

Job Location : Noida
Job Category : Full-time
Salary : As per industry trends

Min Qualifications : Diploma or B.Tech in Electronics Engineering

Required Experience : 2-3 years (Core Experience)

Role & Responsibilities : PCB Design Engineer, responsibilities include the following:

  • This position performs schematic capture, layout and implementation of design rules on PCBs of varying complexity.

  • Prepares sketches, block diagrams, schematic diagrams, wiring diagrams, PCB layout etc.

  • Prepare assembly drawings and BOMs.

  • Works closely with Electrical engineers to apply all inputs and information as required developing final design drawings as appropriate.

  • Familiar with PCB stack-up design, Signal Integrity intensive layout design techniques and at identifying potential layout design issues and providing options for solutions.

  • Perform medium complexity schematic edits as required.

  • Manages small complexity projects independently.

  • Ensures departmental compliance to quality requirements. May inspect and review PCBs for manufacturing and test-ability.

  • Proficiency in the creation for all PCB related documentation including the PCB drawing, module assembly drawing, PCB configuration and revision management, PCB parts list, and project folder.

  • Recommends possible PCB Design automation within the design tools.

  • Helps reach consensus and achieve results within a project team.

  • Documents/updates existing PCB CAD/CAM design procedures, guidelines, and specifications.

  • Provides input to PCB Design project requirements and schedule estimates. Communicates project status, concepts and issues.

  • Work under the direction of senior members of the PCB Design team.

Required Skills :

  • Minimum of five years of CAD/CAM experience in PCB manufacturing or other company.

  • Hands on design experience with computer-aided (CAD) tools, methods for PCB design, auto routers, crosstalk analysis, impedance matching, documentation and automated design rule checking.

  • Proficiency in communication of technical and business ideas through engineering drawings as well as written and spoken English.

  • Minimum of three years Altium Design Software experience.

Preferred Skills :

Good Communication, Fit Personality, Young professional ,Focused, Hardworking, Good Knowledge NAND flash design and ASIC design of & Other designing techniques.

Note : Interested & Candidate can email their CV on [email protected] or fill the below mention form.



Job Posting Date & Status: 23rd SEP 2020 & Active

NAND Flash Package Design Engineer

(Engineering)

Job Location : BANGLORE or BHIWADI
Job Category : Full-time
Salary : As per industry trends

Min Qualifications : B.Tech \ M.Tech in Computer Science or Electronics & Communications Engineering

Required Experience : More than 10 years in designing and simulating memory (Flash) packages

Role & Responsibilities : A NAND Flash Package Design Engineer, responsibilities include the following:

  • Perform full flash storage-based systems design, analysis, integration and verification from product definition.

  • Participates in cross functional meetings such as with memory, firmware and product line teams to define and design experiments to collect data for system level analysis.

  • Provides feedback on new system features for next generation memory developments.

  • Design new memory packages as per customer and market requirement from scratches.

Required Skills :

  • Must have knowledge of Substrate design.

  • NAND flash design and ASIC design will be preferred.

  • NAND flash packaging process flow knowledge is required.

  • Basic knowledge of CMOS technology and substrate layout and process flow.

  • Experience with embedded storage device packaging is a plus.

  • Management & Teamworking skills

  • Excellent verbal and written communications skills.

  • Highly organized, self-motivated, and disciplined abilities.

  • Ability to work with other engineers across multiple disciplines, as well as customers of various positions.

  • Experience working with off-shore teams in a multi-national environment.

Preferred Skills :

Good Communication, Fit Personality, Young professional, Focused, Hardworking, Good Knowledge NAND flash design and ASIC design of & Other designing techniques.

Note : Interested & Candidate can email their CV on [email protected] or fill the below mention form.


If you are interested please fill the below mention form.

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