| |
|
1. SMT equipment
|
|
| SMT LINE 1: State of the
art SMT Pick and Place Machine with BGA capability
from FUJI,
Japan. |
|
| |
|
• 1-Fuji- GSP-Auto vision
fully Automatic Screen Printer
|
|
| |
|
•
1-Fuji- IP-II - High Speed Fine Pitch Placer
High Speed : 0.18 sec/Components { 20K CPH)
Three Device Table Mode
140 ( 70+70) Slots for 8mm Tape Feeders
Turret Type 12 Placing Heads, Each placing head
carries three
sizes of Pick & Place nozzles
Place able Parts: 1005 to SSOP & SQFP
Vision Correction Unit for reading Fiducial
Placing accuracy: ± 0.10 mm
PCB Size: 457mm X 356 mm
|
|
| |
• 1-Fuji- CP-IV-
High Speed Chip Shooter
Components Type: Tape, Tray, Sticks and Matrix Tray
Feeder
Components Range: 1608 to large & Heavy PLCC(
54 Sq. mm QFP) Double Placement Head
Automatic Nozzle Changer
Precision Placement with High resolution Image sensor
Camera.
Placement of Components upto 10 mm height.
PCB Size: 457 X 356 mm
Speed: 0.7 Sec/chip, 2.8 sec/IC, 4.0 sec/tray Component
Placing Accuracy: ± 0.1mm
Placing Capability: 0.3mm [12mil] fine pith component.
_______________________________________________________________________________
|
| SMT LINE 2: State of the
art SMT Pick and Place Machine with BGA capability
from
MDC, Japan. |
|
• 1-EMS- SP-20/20 Semi Automatic Screen Printer
Max Screen Size 20”x20”
Max Image 12”x12”
|
|
• 1-MDC- ECM96 Chip cum
fine pitch placer
20 mil pitch
24 feeders
0402 to 2”x2”
18”x18” placement area |
|
|
________________________________________________________________________________ |
| |
|
| • 1-SMT- 300/3.0 –
Multi Zone , Slotted Nozzles Re-flow Oven |
|
|
________________________________________________________________________________ |
| • 1-EMS - Gallant Single
Zone Hot Air Convection Re-flow Oven |
|
|
_______________________________________________________________________________________________________________ |
| |
|
2. Through Hole Assembly • 2-Time Eng.
– Manual Insertion Rails Platform
• 1-Estovir - Manual Insertion Converized Platform
• 5-Time Eng. – Table Top Insertion Cum
soldering Jigs
|
|
|
_______________________________________________________________________________________________________________ |
3.
Soldering
• 1-Control signal- 18”
Dual Waves chain Conveyor Soldering Machine
• 2-Baking Oven
• 4-Weltron – Temp. Controlled Soldering
Irons
• 3-Hakko - Temp. Controlled Hot Air Guns
|
|
|
_______________________________________________________________________________________________________________ |
| 4. Component Preparation
• 2-Time Eng. Axial lead former cum
cutter
• 1-Time Eng. Radial lead former cum cutter
• 1-Time Eng. DIP IC lead Straighter
• 2-HiLo System-Data I/O high Speed Universal
Programmer
• 1-HiLo System- Gang 08 Programmer
|
|
|
_______________________________________________________________________________________________________________ |
| |
|
| 5. Cleaning •
1-Thorough Clean – 15’ (feet) Multi-
Stage ,Compatible with Aqueous base
Ultrasonic Cleaning
Machine
• 1-Thorough Clean - 8’ ( Feet) Multi Stage
Ultrasonic Cleaning Machine.
|
|
|
_______________________________________________________________________________________________________________ |
6. Loaded Board Test • 1-P&E- BDM
In-Circuit Programmer
• 1-Motorola- EBDI In-Circuit Programmer
• 1-Silab- EC2 – In-Circuit Programmer
• 1-Booster- In-Circuit Test System
• 1-Koyoritsu- High Speed MDA In-Circuit Test
System
• 1-Tektronix - TDS 2012 100 MHZ, Dual Channel
Scope
• 1-HP3410 - High Resolution Multimeter
• 5-Motwane - Bench Multimeters
• 1-Tenma - 5 Mhz, Frequency Generator Cum Counter
• 5-Sigma - DC Variable Power Supplies
|
|
|
_______________________________________________________________________________________________________________ |
7. Process Control • 1-Agilent - AOI
System
• 1-ERSA - BGA Inspection
• 1-Scientific - LCR Q Bridge ( LCR Meter)
• 1-Lensel - 8X Inspection Table top Scopes
• 2-Weller - Digital Thermometer
• 1-Mititoyo - Micro-meter
• 1-Mititoyo - Vernier Caliper
|
|
