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  Equipment Specifications:
 
 
   
1. SMT equipment
 
 
SMT LINE 1: State of the art SMT Pick and Place Machine with BGA capability from                     FUJI, Japan.  
   

1-Fuji- GSP-Auto vision fully Automatic Screen Printer

   
• 1-Fuji- IP-II - High Speed Fine Pitch Placer

High Speed : 0.18 sec/Components { 20K CPH)
Three Device Table Mode
140 ( 70+70) Slots for 8mm Tape Feeders
Turret Type 12 Placing Heads, Each placing head carries three
sizes of Pick & Place nozzles
Place able Parts: 1005 to SSOP & SQFP
Vision Correction Unit for reading Fiducial
Placing accuracy: ± 0.10 mm
PCB Size: 457mm X 356 mm

 
1-Fuji- CP-IV- High Speed Chip Shooter

Components Type: Tape, Tray, Sticks and Matrix Tray Feeder
Components Range: 1608 to large & Heavy PLCC( 54 Sq. mm QFP) Double Placement Head
Automatic Nozzle Changer
Precision Placement with High resolution Image sensor Camera.
Placement of Components upto 10 mm height.
PCB Size: 457 X 356 mm
Speed: 0.7 Sec/chip, 2.8 sec/IC, 4.0 sec/tray Component
Placing Accuracy: ± 0.1mm
Placing Capability: 0.3mm [12mil] fine pith component.

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SMT LINE 2: State of the art SMT Pick and Place Machine with BGA capability from                     MDC, Japan.  

1-EMS- SP-20/20 Semi Automatic Screen Printer

Max Screen Size 20”x20”
Max Image 12”x12”

 




1-MDC- ECM96 Chip cum fine pitch placer

20 mil pitch
24 feeders
0402 to 2”x2”
18”x18” placement area

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1-SMT- 300/3.0 – Multi Zone , Slotted Nozzles Re-flow Oven

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1-EMS - Gallant Single Zone Hot Air Convection Re-flow Oven  
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2. Through Hole Assembly

2-Time Eng. – Manual Insertion Rails Platform
1-Estovir - Manual Insertion Converized Platform
5-Time Eng. – Table Top Insertion Cum soldering Jigs

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3. Soldering

1-Control signal- 18” Dual Waves chain Conveyor Soldering Machine
2-Baking Oven
4-Weltron – Temp. Controlled Soldering Irons
3-Hakko - Temp. Controlled Hot Air Guns

 
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4. Component Preparation

2-Time Eng. Axial lead former cum cutter
1-Time Eng. Radial lead former cum cutter
1-Time Eng. DIP IC lead Straighter
2-HiLo System-Data I/O high Speed Universal Programmer
1-HiLo System- Gang 08 Programmer

 
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5. Cleaning

1-Thorough Clean – 15’ (feet) Multi- Stage ,Compatible with  Aqueous base Ultrasonic                                 Cleaning Machine
1-Thorough Clean - 8’ ( Feet) Multi Stage Ultrasonic Cleaning Machine.

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6. Loaded Board Test

1-P&E- BDM In-Circuit Programmer
1-Motorola- EBDI In-Circuit Programmer
1-Silab- EC2 – In-Circuit Programmer
1-Booster- In-Circuit Test System
1-Koyoritsu- High Speed MDA In-Circuit Test System
1-Tektronix - TDS 2012 100 MHZ, Dual Channel Scope
1-HP3410 - High Resolution Multimeter
5-Motwane - Bench Multimeters
1-Tenma - 5 Mhz, Frequency Generator Cum Counter
5-Sigma - DC Variable Power Supplies

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7. Process Control

1-Agilent - AOI System
1-ERSA - BGA Inspection
1-Scientific - LCR Q Bridge ( LCR Meter)
1-Lensel - 8X Inspection Table top Scopes
2-Weller - Digital Thermometer
1-Mititoyo - Micro-meter
1-Mititoyo - Vernier Caliper

 
 
     
     
 
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